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AMAOE EMMC3 BGA Reballing Stencil EMCP EMMC Memory Flash IC Reball Solder Tin Plant Net Steel Mesh Weld Heat
AMAOE EMMC3 BGA Reballing Stencil EMCP EMMC Memory Flash IC Reball Solder Tin Plant Net Steel Mesh Weld Heat
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Regular price
$20.00 AUD
Regular price
Sale price
$20.00 AUD
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Features & Specifications
• 【Versatile Compatibility】Designed for EMMC3 BGA, compatible with various models including BGA162, 153, 169, 221, 186, 254, EMCP, and EMMC Memory Flash IC.
• 【Precision Reball Tool】Specialized steel mesh for accurate solder tin planting in BGA rework and repair processes.
• 【Professional Grade】High-quality stencil for EMMC3 chip reballing, ensuring precise solder application.
• 【Heat Resistant】Engineered to withstand high temperatures during the soldering process, maintaining shape and accuracy.
• 【Easy to Use】Facilitates efficient and reliable reballing for both professional technicians and DIY enthusiasts.
Compatible with
• Universal Models
• Universal
Package included
• 1 x BGA Reballing Stencil
• 【Versatile Compatibility】Designed for EMMC3 BGA, compatible with various models including BGA162, 153, 169, 221, 186, 254, EMCP, and EMMC Memory Flash IC.
• 【Precision Reball Tool】Specialized steel mesh for accurate solder tin planting in BGA rework and repair processes.
• 【Professional Grade】High-quality stencil for EMMC3 chip reballing, ensuring precise solder application.
• 【Heat Resistant】Engineered to withstand high temperatures during the soldering process, maintaining shape and accuracy.
• 【Easy to Use】Facilitates efficient and reliable reballing for both professional technicians and DIY enthusiasts.
Compatible with
• Universal Models
• Universal
Package included
• 1 x BGA Reballing Stencil
Customs & Import Duties
Customs & Import Duties
All customs duties, taxes, and import fees are the responsibility of the buyer. Please check your country's import regulations before placing an order.
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