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BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net

BEST High Temperature Resistant Chip Fixing Sticker for BGA Reballing 3D Tin Planting Net

Regular price $20.00 CAD
Regular price Sale price $20.00 CAD
Sale Sold out
Features & Specifications
• 【High-Temperature Resistant】Specially designed adhesive tape capable of withstanding high temperatures, ideal for soldering and chip mounting applications.
• 【3D Solder Mask Terminator】Effectively secures and terminates 3D solder masks, ensuring precise chip placement and soldering.
• 【Advanced Polymer Material】Utilizes high-quality polymer material for superior durability and performance in electronic assembly processes.
• 【Instant Positioning】Features a quick-stick design that allows for immediate and accurate positioning of chips and components.
• 【Corrosion Resistant】Provides excellent protection against corrosion, extending the lifespan of mounted chips and electronic components.

Specifications:
• Material: High-polymer, heat-resistant adhesive
• Application: Chip fixation, 3D solder mask termination
• Features: High-temperature resistance, corrosion protection
• Positioning: Instant (one-second) adhesion
• Base Layer: Fire-resistant high-polymer adhesive

Compatible with
• Universal Models
• Universal

Package included
• 1 × Chip Fixing Sticker

Customs & Import Duties

All customs duties, taxes, and import fees are the responsibility of the buyer. Please check your country's import regulations before placing an order.

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