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BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
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Regular price
$16.00 CAD
Regular price
Sale price
$16.00 CAD
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Features & Specifications
• Made by high quality metal material
• Easy and quickly for reballing the BGA IC
• Excellent to replace IC or BGA rework reballing
Compatible with
• Universal Models
• Universal
Package included
• 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
• Made by high quality metal material
• Easy and quickly for reballing the BGA IC
• Excellent to replace IC or BGA rework reballing
Compatible with
• Universal Models
• Universal
Package included
• 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
Customs & Import Duties
Customs & Import Duties
All customs duties, taxes, and import fees are the responsibility of the buyer. Please check your country's import regulations before placing an order.
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