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MAANT A8-A18 Pro 12Pcs Chip CPU BGA Reballing Stencil Template Net for iPhone Chip Repair
MAANT A8-A18 Pro 12Pcs Chip CPU BGA Reballing Stencil Template Net for iPhone Chip Repair
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Regular price
£29.00 GBP
Regular price
Sale price
£29.00 GBP
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Features & Specifications
• 【Precision Laser-Cut BGA Stencils】High-precision stainless steel construction with square chamfer design (1/4-1/2 mil) ensures accurate solder ball placement and uniform distribution for professional BGA reballing.
• 【Magnetic Power Tin Planting Platform】The magnetic power tin planting platform provides a secure grip, simplifying the reballing process for a wide range of CPUs.
• 【Professional-Grade Manufacturing】Constructed from medical-grade 304/316L stainless steel with ±2μm hole precision, ensuring durability and consistent performance in professional repair environments.
• 【Precision Alignment Features】Each stencil includes four corner positioning holes (Φ3.0mm) and center cross-reference marks for accurate chip-to-stencil alignment during repairs.
• 【Chip-Specific Design】Each model features custom aperture patterns matching specific BGA chip layouts, preventing bridging and cold joints while ensuring optimal solder ball distribution.
Package included
• 12 x BGA Reballing Stencil Template Net
• 【Precision Laser-Cut BGA Stencils】High-precision stainless steel construction with square chamfer design (1/4-1/2 mil) ensures accurate solder ball placement and uniform distribution for professional BGA reballing.
• 【Magnetic Power Tin Planting Platform】The magnetic power tin planting platform provides a secure grip, simplifying the reballing process for a wide range of CPUs.
• 【Professional-Grade Manufacturing】Constructed from medical-grade 304/316L stainless steel with ±2μm hole precision, ensuring durability and consistent performance in professional repair environments.
• 【Precision Alignment Features】Each stencil includes four corner positioning holes (Φ3.0mm) and center cross-reference marks for accurate chip-to-stencil alignment during repairs.
• 【Chip-Specific Design】Each model features custom aperture patterns matching specific BGA chip layouts, preventing bridging and cold joints while ensuring optimal solder ball distribution.
Package included
• 12 x BGA Reballing Stencil Template Net
Customs & Import Duties
Customs & Import Duties
All customs duties, taxes, and import fees are the responsibility of the buyer. Please check your country's import regulations before placing an order.
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