1
/
of
1
unbranded
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
No reviews
Regular price
$19.19 NZD
Regular price
Sale price
$19.19 NZD
Unit price
/
per
Couldn't load pickup availability
Features & Specifications
• Made by high quality metal material
• Easy and quickly for reballing the BGA IC
• Excellent to replace IC or BGA rework reballing
Compatible with
• Universal Models
• Universal
Package included
• 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
• Made by high quality metal material
• Easy and quickly for reballing the BGA IC
• Excellent to replace IC or BGA rework reballing
Compatible with
• Universal Models
• Universal
Package included
• 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
Customs & Import Duties
Customs & Import Duties
All customs duties, taxes, and import fees are the responsibility of the buyer. Please check your country's import regulations before placing an order.
Share
